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Chiplet
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Siemens EDA Outlines Strategic Direction for an AI-Powered, Software-Defined, Silicon-Enabled Future

Siemens EDA Outlines Strategic Direction for an AI-Powered, Software-Defined, Silicon-Enabled Future
by Kalar Rajendiran on 06-09-2025 at 6:00 am
Categories: 3D IC, AI, Chiplet, EDA, Siemens EDA

Software defined Systems of Systems

In a keynote delivered at this year’s Siemens EDA User2User event, CEO Mike Ellow presented a focused vision for the evolving role of electronic design automation (EDA) within the broader context of global technology shifts. The session covered Siemens EDA’s current trajectory, market strategy, and the changing landscape … Read More

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Cadence at the 2025 Design Automation Conference

Cadence at the 2025 Design Automation Conference
by Daniel Nenni on 06-08-2025 at 10:00 am
Categories: Cadence, Chiplet, EDA, Events

Cadence, a DAC 2025 industry sponsor, will exhibit in booth 1609 at the 62nd Design Automation Conference at San Francisco’s Moscone West Convention Center.

Highlights:

Paul Cunningham, SVP and GM of the System Verification Group, Cadence, will speak at Cooley’s DAC Troublemaker Panel. This discussion will be an open… Read More

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The SemiWiki 62nd DAC Preview

The SemiWiki 62nd DAC Preview
by Daniel Nenni on 06-02-2025 at 6:00 am
Categories: AI, Chiplet, EDA, Events

62nd DAC SemiWiki

After being held in San Francisco since the pandemic the beloved Design Automation Conference will be on the move again. In 2026 DAC will be held in Huntington Beach. For you non-California natives, Huntington Beach is a California city Southeast of Los Angeles. It’s known for surf beaches and its long Huntington Beach Pier.… Read More

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Design-Technology Co-Optimization (DTCO) Accelerates Market Readiness of Angstrom-Scale Process Technologies

Design-Technology Co-Optimization (DTCO) Accelerates Market Readiness of Angstrom-Scale Process Technologies
by Kalar Rajendiran on 05-28-2025 at 10:00 am
Categories: 3D IC, Chiplet, EDA, Foundries, Intel Foundry, IP, Synopsys

Sassine Holding an 18A Test chip

Design-Technology Co-Optimization (DTCO) has been a foundational concept in semiconductor engineering for years. So, when Synopsys referenced DTCO in their April 2025 press release about enabling Angstrom-scale chip designs on Intel’s 18A and 18A-P process technologies, it may have sounded familiar—almost expected. … Read More

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Alchip’s Technology and Global Talent Strategy Deliver Record Growth

Alchip’s Technology and Global Talent Strategy Deliver Record Growth
by Kalar Rajendiran on 05-20-2025 at 10:00 am
Categories: 3D IC, AI, Alchip, Chiplet, FinFET, GAA, IP, Semiconductor Services, TSMC
1 Comment

Alchip TSMC 2nm N2

Alchip Technologies Ltd., a global leader in high-performance computing (HPC) and artificial intelligence (AI) ASIC design and production services, continues its trajectory of rapid growth and technical leadership by pushing the boundaries of advanced-node silicon, expanding its global design capabilities, and building… Read More

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Beyond the Memory Wall: Unleashing Bandwidth and Crushing Latency

Beyond the Memory Wall: Unleashing Bandwidth and Crushing Latency
by Lauro Rizzatti on 05-07-2025 at 2:00 pm
Categories: AI, Chiplet

Figure 1

VSORA AI Processor Raises $46 Million to Fast-Track Silicon Development

We stand on the cusp of an era defined by ubiquitous intelligence—a stone’s throw from a tidal wave of AI-powered products underpinned by next-generation silicon. Realizing that future demands nothing less than a fundamental rethink of how we design semiconductors… Read More

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Intel’s Foundry Transformation: Technology, Culture, and Collaboration

Intel’s Foundry Transformation: Technology, Culture, and Collaboration
by Kalar Rajendiran on 05-07-2025 at 10:00 am
Categories: 3D IC, 5G, Automotive, Chiplet, FinFET, Foundries, Intel Foundry, IP
1 Comment

Intel and UMC 2025

Intel’s historical dominance in semiconductor process technology began to erode around 2018, as competitors started delivering higher performance at smaller nodes. In response, Intel is now doubling down on innovation across two fronts: advanced process nodes such as Intel 18A and 14A, and cutting-edge packaging technologies.… Read More

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Intel’s Path to Technological Leadership: Transforming Foundry Services and Embracing AI

Intel’s Path to Technological Leadership: Transforming Foundry Services and Embracing AI
by Kalar Rajendiran on 05-06-2025 at 10:00 am
Categories: 3D IC, AI, Chiplet, FinFET, Foundries, GAA, Intel Foundry
5 Comments

Compressed Dont be encumbered by history

Intel, long a leader in semiconductor manufacturing, is on a determined journey to reclaim its technological leadership in the industry. After facing significant challenges in recent years, the company is making a concerted effort to adapt and innovate, with a clear focus on AI-driven technologies, advanced packaging solutions,… Read More

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Scaling AI Infrastructure with Next-Gen Interconnects

Scaling AI Infrastructure with Next-Gen Interconnects
by Kalar Rajendiran on 04-29-2025 at 6:00 am
Categories: 3D IC, AI, Chiplet, EDA, IP, Synopsys

Data Centers Reimagined for Future of Gen AI

At the recent IPSoC Conference in Silicon Valley, Aparna Tarde gave a talk on the importance of Next-Gen Interconnects to scale AI infrastructure. Aparna is a Sr. Technical Product Manager at Synopsys. A synthesis of the salient points from her talk follows.

The rapid advancement of artificial intelligence (AI) is fundamentally… Read More

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ESD Alliance Executive Outlook Features View of How Multi-Physics is Reshaping Chip Design and EDA Tools

ESD Alliance Executive Outlook Features View of How Multi-Physics is Reshaping Chip Design and EDA Tools
by Bob Smith on 04-24-2025 at 6:00 am
Categories: Chiplet, Events

CEO Outlook #2 (1)

Every spring, the ESD Alliance, a SEMI Technology Community, organizes a get together where industry executives and experts gather to network and talk about trends in the electronic design automation industry.

The theme of this year’s event, once again co-hosted by Keysight, is “How Multi-Physics is Reshaping Chip Design and… Read More